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A key technical issue outlined in the 2001 U.S. photovoltaic road map is the need to develop low-cost, high-throughput manufacturing for highef ciency thin- lm solar cells. Thus, an important process to target for device fabrication for thin- lm solar cells is deposition onto exible, lightweight substrates such as polyimides. Current methods for depositing ternary polycrystalline compounds include coevaporation of elements19 21 or alloys,22 electrodeposition,23 reactive-sintering,24 and ash evaporation,25 which are often followed by toxic sulphurization/selenization steps at increased temperatures. Furthermore, under these conditions, loss of volatile In/Ga chalcogenides is common.19,26 The high-temperature requirements make this protocol incompatible with all currently known exible polyimides or other polymer substrates. In addition, the use of toxic reagents is a limiting factor. The use of multisource inorganic/organometallic precursors in a chemical vapor deposition (CVD) type process is more appealing because of milder process parameters. However, stoichiometric control of deposited lms can be dif cult to achieve, and lm contamination has been reported.27,28 A novel alternative approach is the use of ternary single-source precursors (SSPs), which have the I III VI2 stoichiometry built in and are suitable for low-temperature deposition (Fig. 6.3). Although a rich and diverse array of binary SSPs29 33 are known, characterized, reviewed, and tested, the number of known ternary SSPs is limited, as is their use in deposition processes.29 SSPs

E; Fleig, P F 2002 High resolution integrated passives using microcontact printing Proc SPIE Intl Microelec Packaging Soc (IMAPS) pp 755 759 95 Clem, P G; Jeon, N-L; Nuzzo, R G; Payne, D A 1997 Monolayer-mediated deposition of tantalum (V) oxide thin lm structures from solution precursors J Am Ceram Soc 80:2821 2827 96 Nagata, H; Ko, S W; Hong, E; Randall, C A; Trolier-McKinstry, S; Pinceloup, P; Skamser, D; Randall, M; Tajuddin, A 2006 Micro-contact printed BaTiO3 and LaNiO3 thin lms for capacitors J Am Ceram Soc 89(9):2816 2821 97 Kumar, A; Whitesides, G M 1993 Features of gold having micrometer to centimeter dimensions can be formed through a combination of stamping with an elastomeric stamp and an alkanethiol ink followed by chemical etching Appl Phys Lett 63:2002 2004 98 Fu, Y; Bryan, N.

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The SACL contains Access Control Entries (ACEs) Each ACE contains three items of information critical to the object auditing process: The security principal to be audited (a user or group object) The speci c access type to be audited This is known as the access mask A ag that indicates whether to audit for failed access, successful access, or both For events to appear in the security log, Auditing for Object Access must rst be enabled in Active Directory Then the SACL for each object must be de ned Audit policy change By auditing for policy changes, the security administrator can monitor attempts to change policy Not only can you audit to track and monitor attempts to change policy that governs user rights and other policies, but also attempts to alter audit policy itself Audit privilege use.

Administrators at various levels in a Windows Server 2008 domain exercise certain rights they are given in order to administer a domain Such privileges include backup of les and folders, restoring les and folders, changing the system time, shutting down the system, and so on Auditing the use of privileges for success and failure generates an event each time a user attempts to exercise a user right Enabling the Privilege Use audit does not automatically audit use of every user right By default, the following rights are excluded: Bypass traverse checking Create a token object Replace process level token Generate security audits Backup les and directories Restore les and directories Audit process tracking Processes running on Windows Server 2008 computers can be audited to provide detailed information showing attempts to create processes and end processes.

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